1. rebound
In 2023, the global semiconductor market has gone out of a U -type curve after a long -lasting downward adjustment.
From the perspective of revenue, the semiconductor industry representing enterprises, including non -wafer design enterprises and wafer manufacturing companies, generally show the trend of a sharp decline in the beginning of the year and the slow recovery of middle -aged mid -year.
From the perspective of capacity status, major wafer fabs and IDMs have begun to reduce production capacity since the beginning of the year. By the third quarter of 2023, the capacity utilization rate of major foundries has been as low as 80%, marking that global semiconductor production has entered the capacity from supply and not allowed to enter production capacity.Excess stages.
From the perspective of product prices, in the market sensitivityMemoryFor example, in the first half of 2023, the memory price continued to decline in the second half of 2022. In the middle of the year, the DRAM price fell more than 60%.Since the third quarter of 2023, when the memory is reduced by the original factory, the price rebounds. By December, some memory prices increased by 25%, and there was a continuous rise.
At present, all semiconductor manufacturers have gradually completed their destocking.The World Semiconductor Trade Statistics (WSTS) has recently raised global semiconductor sales forecasts. It is expected that global semiconductor revenue in 2023 is about 520.126 billion US dollars, which is higher than the previously estimated 515095 billion US dollars.
   　2.AI
On May 30, 2023, local time in the United States, Nvidia's market value exceeded the trillion dollar mark for the first time, becoming a semiconductor field and the seventh company in the United States to unlock trillion -dollar market value.Driven by the AI boom caused by ChatGPT, the demand for the AI acceleration chip market has increased.The third quarter financial report released by Nvidia on November 21, 2023 shows that the company's quarterly revenue was US $ 18.12 billion, an increase of 206%year -on -year, and net profit was 9.24 billion US dollars, an increase of 1259%year -on -year. All performances exceeded market expectations.
Under the leadership of AI demand, the processor supplier has released new products for the deployment requirements of large AI models in different fields.In the data center market, AMD launched the MI300X, which is benchmarking the Byrada H200 and Intel GAUDI3; on the PC side, the Intel Core Ultra and Qualcomm X Elite have launched the heterogeneous processor of the CPU+GPU+NPU.Reasoning and providing stronger privacy protection;cell phoneDuan, Qualcomm Snapdragon 8 Gen3 and MediaTek 9300 supported large models to run into the mobile phone, allowing AI capabilities to come to each consumer.
　　3. Visit China
In 2023, executives of semiconductor global leading enterprises visited China intensively.Qualcomm President and Executive Officer An Meng, Apple Corporation Executive Cook, Global President of Asmi, Wen Ningke, NXP Semiconductor Executive Kolt Severus, SamsungelectronicPresident Li Zaiyu and other visiting China, Intel CEO Pat Kissinger visited China three times from mid -April to mid -July.The tide of semiconductor companies has demonstrated the strong attraction of China's oversized market and domestic demand potential to the global semiconductor industry.Semiconductor is one of the industries with complete globalization and complete regional division of labor.Semiconductor companies cannot abandon the Chinese market in pursuing profits. The semiconductor industry must pursue technological progress.The AI model, which is regarded as an important pusher of semiconductor growth, is developing in full swing in the Chinese market and will bring more growth opportunities to global semiconductor companies.
4. Support
In order to encourage local industries, semiconductor hotspots and regions have successively launched semiconductor support policies in 2023.
The United States announced that the National Advanced Packaging Manufacturing Plan (NAPMP) is expected to invest about 3 billion U.S. dollars to support the US chip packaging industry; the EU "Chip Act" will officially take effect, and it is planned to cost 43 billion euros.Raise to 20%in 2030; South Korea issued the K-Chips Act to provide tax discounts for local semiconductor companies; Japan announced the amendments to the "Semiconductor and Digital Industry Strategy", which proposed that the sales of semiconductor sales produced in China by 2030 will double to 15 to 15More than one trillion yen; the Indian government plans to restart the incentive measures and assistance applications for US $ 10 billion to encourage local chips.
Behind policy -intensive introduction, reflecting the strategic role of semiconductors on global scientific and technological innovation and even economic development, and will have a profound impact on the global scientific and technological industry pattern in the future.
　　5. Listing
Although the global capital market became calm in 2023, there are still many semiconductor listing at home and abroad, and even the top three of the IPO financing of science and technology boards have been held by semiconductor companies.
In September 2023, 7 years after the privatization of SoftBank Group, ARM officially landed on the global selection market listing of Nasdaq, and raised about $ 4.87 billion in funds. Intel, Apple, Nvidia, AMD and other customers are the cornerstoneInvestors.In October, Kokusai Electric, a Japanese semiconductor equipment manufacturer, carried out the first public offering of Japan since 2018, and the stock price rose 15%on the day of listing.
In China, the three major wafer fab have won the top three IPO financing of science and technology board stocks that year.In May 2023, Jinghe Integration and Xinlian Integration were listed one after another, focusing on displayingDriver chipWaver -level chip's wafer foundry.In August, Hua Hong Semiconductor was officially listed on the Science and Technology Board. The IPO raised funds of 21.2 billion yuan, becoming an A -share IPO in 2023.
　　6. Acquisition
Although the anti -wind cycle of the semiconductor market has not yet passed, the pace of corporate acquisitions has never stopped.In 2023, there are many mergers and acquisitions in the fields of AI, EDA, and wide control belt.From the perspective of quantity, the electronic system design enterprise represented by EDA is active. Cadence will income the three electronic system design companies, and Xinshi Technology spends more than $ 200 million to acquire German software company Piketec.From the perspective of scale, two large acquisitions of wide -band semiconductors have caused heated discussions. Yingfeeling acquired Nitrome Systems Company at $ 830 million, and Bosch spent $ 1.5 billion to acquire chip manufacturers TSI, all showing that the field of wide -native semiconductor fields was highlighted.Development confidence.Behind the semiconductor industry, AI has become a convention.Aiming at the goal of the coordinated software and hardware, AMD acquired two AI software companies, and Microsoft acquired DPU suppliers.Nvidia and British Fei Ling both have edge equipment and machine learning enterprises to account for the AI market on the edge of the beach.
  7. Creating core
In 2023, in the context of AI computing power and Nvidia A100 and H100, Nvidia's downstream customers have joined the core.Google focuses on the research and development of TPUs of TPU, and its TPU V4 and V5 have been applied to the training of Google's big model Gemini; Microsoft and Amazon have released self -developed chips Maia 100 and Trainium 2, which is expected to get more in their own product update cycle.More active rights.
In addition to the data center, new energy vehicles are also the main battlefield of cross -border core.In July 2023, Tesla released the FSD HW4.0 autonomous driving chip to handle autonomous driving related tasks such as vehicle perception, decision -making and control.Yang Yan from the research laser radar chip is used to provide more real -time and accurate data for autonomous driving and effectively reduce power consumption.In the future, the integration awareness of automobile OEMs will continue to improve the industrial chain to build a highly coupling automotive intelligent system for software and hardware.
　8. get on the car
With the continuous improvement of automobile intelligence, functional scenarios such as smart driving, smart cockpit, and smart gateway continued to emerge, and the requirements for computing power were more diverse.In 2023, the smart cockpit chip with advanced processes was officially launched. The new Mercedes -Benz long wheelbase E -Class, Jiyue 01, and Ji Ji 001 FR successively set up the first 5nm smart cockpit chip in the industry -Qualcomm Snapdragon 8295.Large computing autonomous driving chips have also become popular.The polar 007 and Weilai ES7 are equipped with one of the self -driving integrated chips with strong computing power on the market -Nvidia Drive Orin, and a single chip computing power reaches 254TOPS.The continuous improvement of the computing power of the vehicle chip will open a larger space for the development and innovation of automobile intelligent functions.At the end of 2023, Xiaomi followed the footsteps of the new forces of the car, and released the SU 7 pure electric car, equipped with two NVIDIA Drive Orin and Qualcomm Snapdragon 8295, which seized the hardware configuration.
　   9. 2nm
In 2023, the 2NM chip manufacturing equipment continued, and the global semiconductor industry took a key step towards 2NM.On December 21, ASML, a Dutch semiconductor equipment manufacturer, was the first to announce that it had delivered the first HIGH NA (high numerical aperture) EUV (extremely UV) photoresal system to Intel.Critical dimensions -from 13nm of the 0.33NA system to 8nm of the 0.55NA system, the prelude to the battle for the 2nm chip equipment.The Japanese Optical Machine Factory Canon followed closely, and the official announcement of 2NM manufacturing progress.On December 25, Canon revealed that the nano -printing technology printed the mask of the semiconductor circuit diagram on the wafer. It only needs to be printed to form a complex two -dimensional or three -dimensional circuit in a suitable position.And the actual cost can be reduced to half of the traditional photobladed equipment.The successive breakthrough of 2NM manufacturing equipment also shows that the semiconductor industry is moving towards a new stage of manufacturing.
　　10.RISC-V
Low -end, can only make small chips, limited to onlyMCUThis is the impression that the RISC-V architecture has gained a lot since the appearance of the market.For a long time, high-end upgrades have been the key to the RISC-V instruction set architecture.In 2023, the RISC-V architecture achieved breakthrough progress in the high-end applications such as laptops, servers, and AI: March, Jianshi Technology and Deep Divine Wisdom officially released the world's first RISC-V laptop ROMA.(Open Kirin) The operating system is encapsulated by 12nm/28nm SOM.In the same month, the first server-grade RISC-V CPU was released as a server-level RISC-V CPU. The single chip has 64 RISC-V core and supports 256GB of memory capacity.In August, Pingtou released a self-developed RISC-V AI platform to support more than 170 mainstream AI models.For a long time, the RISC-V has been benchmarking with the ARM architecture. In 2023, the RISC-V single-core performance has been improved to the ARM Cortex-A7 or even higher.