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沪硅产业扩产300mm半导体硅片
沪硅产业扩产300mm半导体硅片
Auth：
现代芯城元器件采购平台
Date：
2024/6/19
Source：
现代芯城元器件采购平台
Visit：
1240
Related Key Words:
沪硅产业扩产300mm半导体硅片
Previous："Innovation · "Quality" Leapfrog: How To Communicate With China Enterprise Communications, The High -Quality Development Of The ICT Industry"
Next："L-COM: The Industrial Interconnection Resource Library Around The Engineer"
沪硅产业扩产300mm半导体硅片
沪硅产业发布公告称，为积极响应国家半导体产业发展战略，加速推进公司长远发展战略规划，抢抓半导体行业发展机遇，持续扩大公司集成电路用300mm硅片的生产规模，提升公司全球硅片市场占有率与竞争优势，公司拟投资建设集成电路用300mm硅片产能升级项目。
本项目预计总投资132亿元，将用于土地购置、厂房及配套设施建设、设备购置及安装等。项目建成后，公司300mm硅片产能将在现有基础上新增60万片/月，达到120万片/月。
Previous："Innovation · "Quality" Leapfrog: How To Communicate With China Enterprise Communications, The High -Quality Development Of The ICT Industry"
Next："L-COM: The Industrial Interconnection Resource Library Around The Engineer"
Industry Information
Global Smartphone Sales Declined In The First Quarter, With Only Apple And Samsung Growing, Supporting The Performance Of Hon Hai And Largan
Samsung Electro-Mechanics Plans To Set Up An MLCC Embedded Substrate Production Line In Vietnam To Expand AI Packaging Production Capacity
ADI Launches New Back-End Manufacturing Facility In Thailand
Huawei’S R&D Investment In 2025 Will Reach 192.3 Billion Yuan, Surpassing Samsung
TSMC’S Single-Quarter Revenue Exceeded The Threshold Of NT$1 Trillion For The First Time, And The Annual Growth May Exceed 30%
Changdian Technology Releases 2025 Annual Report: Full-Year Revenue Hits Record High, Total Profit Increases Year-On-Year
Storage Hyperloop?AI Bubble?Industry Boss’S Personal Experience
Total Investment Is 20 Billion Yuan!Xiamen Silan Microelectronics 12-Inch Chip Production Line Project Signed And Implemented
Invest 60 Million US Dollars!Stmicroelectronics FOPLP Pilot Advanced Chip Wire Investment Construction
Infineon Launches Sic Grooved Super Junction (TSJ) Technology
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