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TDK 推出了一系列高值金属框架多芯片陶瓷电容器
TDK 推出了一系列高值金属框架多芯片陶瓷电容器
Auth：
现代芯城元器件采购平台
Date：
2024/9/11
Source：
现代芯城元器件采购平台
Visit：
1181
Related Key Words:
TDK 推出了一系列高值金属框架多芯片陶瓷电容器
Previous："Innovation · "Quality" Leapfrog: How To Communicate With China Enterprise Communications, The High -Quality Development Of The ICT Industry"
Next："L-COM: The Industrial Interconnection Resource Library Around The Engineer"
TDK 推出了一系列高值金属框架多芯片陶瓷电容器
TDK 推出了一系列高值金属框架多芯片陶瓷电容器，用于汽车电力传动系统、车载充电器和无线电力传输系统，这些电容器必须处理高电流或电压，或具有高容量。
“为了满足这些需求，TDK 开发了 CA 系列，这是业内的 MLCC [6 x 5.6 x 6.4mm]，采用金属框架和三线式结构，”该公司表示。该系列包括“1 类电介质的 99nF 1,000V 和 2 类电介质的 47μF 100V”。资格“基于 AEC-Q200”。
其 ESR（等效串联电阻）较低 - 以上面的例子来说，6 x 8.4 x 6.4 COG 电介质 99nF 1,000V 部件在 100kHz 时的得分为 1.6mΩ，而 6 x 7.5 x 6.4 X7R 电介质 47μF 100V 的得分为 2mΩ。
Previous："Innovation · "Quality" Leapfrog: How To Communicate With China Enterprise Communications, The High -Quality Development Of The ICT Industry"
Next："L-COM: The Industrial Interconnection Resource Library Around The Engineer"
Industry Information
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ADI Launches New Back-End Manufacturing Facility In Thailand
Huawei’S R&D Investment In 2025 Will Reach 192.3 Billion Yuan, Surpassing Samsung
TSMC’S Single-Quarter Revenue Exceeded The Threshold Of NT$1 Trillion For The First Time, And The Annual Growth May Exceed 30%
Changdian Technology Releases 2025 Annual Report: Full-Year Revenue Hits Record High, Total Profit Increases Year-On-Year
Storage Hyperloop?AI Bubble?Industry Boss’S Personal Experience
Total Investment Is 20 Billion Yuan!Xiamen Silan Microelectronics 12-Inch Chip Production Line Project Signed And Implemented
Invest 60 Million US Dollars!Stmicroelectronics FOPLP Pilot Advanced Chip Wire Investment Construction
Infineon Launches Sic Grooved Super Junction (TSJ) Technology
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