5g Chip Packaging: Long Power Positive Layout, Three Taiwan Manufacturers Or Benefit

According to a survey conducted by Taiwan research institutes, 5G high frequency communication chip packaging is expected to develop towards AiP technology and fan-out packaging technology in the future. It is expected that TSMC, Rizhao and Li Cheng are expected to enter the relevant packaging area.

According to Taiwanese media reports, looking forward to the wireless communication specifications in the future 5G era, Yang Qixin, an industry analyst at the Institute of International Strategic Development of Industrial Science and Technology, Taiwan Institute of Industry and Research, said that it could be divided into five bands: frequency below 1GHz, 5G IoT mainly used in the field of the Internet of Things, ub-6GHz band evolved from 4G, and 5G high frequency millimeter band.

Looking at the 5G chip packaging technology, Yang Qixin expects that the 5G IoT and 5GSub-6GHz packaging modes will roughly maintain the 3G and 4G era structural modules, which are divided into four main system-level packaging (SiP) and modules: antenna, RF front-end, transceiver and data machine.

As for 5G millimeter wave in higher frequency band, antenna, RF front-end and transceiver need to be integrated into a single system-level package.

In the antenna section, Yang pointed out that the higher the frequency band, the smaller the antenna, it is expected that the 5G antenna will be integrated into a single package with AiP (Antenna in Package) technology and other components.

In addition to multi-chip system-level packaging using carrier boards, Yang said that Fan-out packaging is expected by the market because it can integrate multi-chips and has better performance than system-level packaging based on carrier boards.

From the manufacturers'point of view, it is estimated that TSMC and China's Jiangsu Changdian are positively positioned in science and technology. In addition, Riyueguang and Licheng are also deeply engaged in panel-level fan-out packaging. They will have the opportunity to import 5G RF front-end chip integrated packaging in the future.