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Home > Industry Information > To Meet High -Power Density And Performance Requirements At A High Degree Of Flexibility: Yingfei Expands 1200 V 62 MM IGBT7 Product Portfolio To Launch A New Current Rated Module

To Meet High -Power Density And Performance Requirements At A High Degree Of Flexibility: Yingfei Expands 1200 V 62 MM IGBT7 Product Portfolio To Launch A New Current Rated Module

Auth:现代芯城元器件采购平台 Date:2023/8/7 Source:现代芯城元器件采购平台 Visit:1049 Related Key Words: To meet high -power density and performance requirements at a high degree of flexibility: Yingfei expands 1200 V 62 MM IGBT7 product portfolio to launch a new current rated module

To meet high -power density and performance requirements at a high degree of flexibility: Yingfei expands 1200 V 62 MM IGBT7 product portfolio to launch a new current rated module


    Yingfeeling Technology Co., Ltd. (FSE code: IFX / OTCQX code: IFNNY) launched a 62 MM half bridge and a common launch pole module product portfolio equipped with a 1200 V Trenchstop IGBT7 chip.The current specifications of the module are as high as 800 A, extending the product portfolio of Yingfei Ling's designed with mature 62 mm packaging.The improvement of the current output capability is that when the system designer is designed with a higher schedule, it not only provides the flexibility, but also provides higher power density and more electrical properties.The new module is specifically satisfiedSolar invertersAnd developed by industrial motor -driven and uninterrupted power supply (UPS).In addition, it is widely suitable for electric vehicle charging piles, energy storage systems (ESS) and other new industrial applications.

    Based on the new microorgana technology, the static loss of the 62mm module series equipped with 1200 V Trenchstop IGBT7 chip is far lower than that of the module equipped with the IGBT4 chipset.These characteristics greatly reduce the loss in the application, in the middleswitchThe industrial motor driver working frequently is particularly significant.IGBT's oscillation behavior and controllability have also been improved.In addition, newPower moduleThe overloaded temperature is 175 ° C.
    solid nickel plating copper bottom plate and snail ownerTerminalIt ensures that the package of 62 mm modules has sufficient mechanical strength.The main terminal is located in the center of the packaging. Because its DC link connection is low, it is very suitable for parallel circuit and three -level topology configuration.The standard packaging design and size make this series compatible with the previous module version.In addition, all modules can use the pre -coated thermal interface material (TIM) verified by Yingfei Ling.

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