-
Huawei / Apple Is Eyeing Qualcomm "hard And Soft" Layout Ai MarketSource:laoyaoba.com Release Date:2018/3/8 Click On:7264
Handset chip maker Qualcomm has now launched three generations of platforms aimed at artificial intelligence (AI) and continues to focus on AI applications and the hardware and software needs that they require. As AI con...
Details -
Chip Resistors Have Risen In Price, And The Average Safety Stock Is Less Than 30 DaysSource:laoyaoba.com Release Date:2018/3/7 Click On:5656
Set micro-channel news, Taiwans chip resistance manufacturers continue to blow up the price of wind, Chihlis New Chi Mong branch announcement, on the 5th raised some 25% of the unit price of thick film resistors; Giant G...
Details -
Mediatek Holds Its Breath To Wait For Qualcomm Shareholders To Influence The Market For Mobile Phone ChipsSource:laoyaoba.com Release Date:2018/3/6 Click On:7001
according to Taiwanese media reports, after a period of sluggish shipment of smart phones with inventory adjustments, the second quarter estimated in the new machine reported to the next, it will smell the recovery smell...
Details -
Iphone Uses Power Chip To Transfer Dialog Back To HeadSource:laoyaoba.com Release Date:2018/3/6 Click On:6515
New Development of Apple Power Management Chip Layout. Foreign media reports, chip maker Dialog pointed out that in 2019 to 2020, Apple will extensive use of Dialogs power management chip, is expected to submit the test...
Details -
Huawei's First 5g Commercial Chip Released 5g "leadership Circle" Competition UpgradeSource: Release Date:2018/3/5 Click On:12810
On the MWC2018, Huawei released the first 3GPP 5G01 commercial standard chip 5G01 (Balong 5G01) and Huawei 5G CPE (Consumer Premise Equipment) to support the worlds mainstream 5G band and theoretically achieve data downl...
Details -
The Chip Resistance Gap Does Not Lose Mlcc, And The Supply And Demand Of Q2 Will Be More TenseSource:laoyaoba.com Release Date:2018/3/5 Click On:5262
Following a heavy warning from MLCC maker Murata, it announced that some of its MLCC products will be reduced by 50% in 2017 and prices will increase. Product order price increases will take effect immediately (March 2)....
Details -
Iek: Dram Unit Price Rose 55% Last Year, Up Another 32% This YearSource:IEK Release Date:2018/2/5 Click On:5282
Industrial Research Institute of ITRI (IEK) cited market research institutions survey report pointed out that last year the global DRAM prices soar, the output value increased by about 77%, reaching 72.5 billion US dollars, the average sales price rose 55%; this year, the pre- Estimated or in short supply, although the strength is not as good as last year's growth, but the major suppliers are still increasing their production under control. The average selling price is expected to rise more than 32% this year, and its annual output value will increase by about 23% to nearly 90 billion U.S. dollars , A new high over the years.
Details -
Samsung Electronics Revenue In 2017 Rose 19%, The Chip Business Accounted For 31%Source: Release Date:2018/2/1 Click On:4837
January 31, although the memory chip prices have dropped than in the past, but Samsung's future mobile phones and other mobile products is still strong demand. Earnings report, Samsung Electronics fourth quarter operating profit up 64% year-on-year to 15.15 trillion won (about 141.38 billion US dollars), memory contribution to profits accounted for about 2/3 of 10.2 trillion won, compared with the same period in 2016 Grow more than twice.
Details -
Tsmc 7nm Process Chip Again Broadcom Ai ChipSource: Release Date:2018/1/22 Click On:6120
Broadcom unveiled its silicon-proven 7nm IP core that will power popular AI (Artificial Intelligence), 5G and high-bandwidth networking markets with Application Specific ASICs (ASICs). Broadcom to build 7-nanometer ASIC for customers to finalize the design finalized by the end of the year, Broadcom also said it will be 7 nanometer ASIC foundry and CoWoS package orders by TSMC is responsible for.
Details -
Altek, Huajing Branch Will Release The Latest 3d Sensing Depth Chip At CesSource:Altek Release Date:2018/1/8 Click On:3839
International Consumer Electronics Show CES exhibition on January 9 will be launched in Las Vegas, Taiwan digital imaging program expert Hua Jingke will be released at the CES show the latest 3D sensing depth chip AL6100, hoping to borrow by The world's largest science and technology exhibition so that the world see Huajing Branch of the technical strength and products.
Details
Popular Industry Information
- 1 5G Business Is Expected To Continue To Drive South Korea Exports
- 2 Amd And Nvidia Fail By Quantity Pricing Strategy Gpu Price Rise Is Still Hard To Stop
- 3 New All-optical Diode Can Be Used In Miniature Optical Circuits
- 4 Resistance Rises Again: Tdk Capacitor Rises 3-4 Times
- 5 Stmicroelectronics Announced The Initial Revenue In The Fourth Quarter Of 2020
- 6 Global Crystal: Acquisition Of The World's Lowest Price Drop 15% Of The Acquisition Time Is Extended To February 10
- 7 Toshiba's $18 Billion Chip Sale Could Not Be Completed On Time: Or Consider Ipo
- 8 Zikuo Shares Combined Acquisition And Holdings Purple Transport Cloud Perfect Cloud Computing Industry Chain
- 9 Intel Needs To Expand Wafer To Strengthen Dram Advantage If It Wants To Get Back To First Place
- 10 This Year's First Quarter Of The Station, 5 Nanometers, Or Still Maintains High-End
- Hot Keywords:
- All Intel Samsung AMD TSMC chip Qualcomm semiconductor Semiconductor 5G Apple MediaTek NVIDIA AI high pass IC Google AI chip The Department of United hair DRAM Taiwan High pass CPU Foxconn MLCC Q2 HUAWEI Technology electronics Huawei Chip Microelectronics Semiconductor ICs Mobile phone Microsoft revenue apple Toshiba NXP ARM 7 nanometers ASIC Samsung Electronics semiconductors microelectronics 7Nm products SEMI TM Hon Hai Qorvo
