In February 2016, Qualcomm released Xiaolong Wear 2100 SoC for wearable devices. But two years later, the market performance of Android Wear (later renamed Wear OS) has been unsatisfactory. Fortunately, in an interview with foreign media Wearable in the near future, highpass wearable director Pankaj Kedia said, "the company has realized this problem and will launch an upgrade chip for flagship smart watches this fall, and many partners will also launch a Wear OS based on the new chip on the day of the festival. Wear equipment.

Artificial intelligence (AI) platform will undoubtedly open another wave of 5G killer applications. The evolution process from 4G to 5G is not only the complexity of the network, but also the equipment and types that mus...

Hua Hong Semiconductor Co., Ltd. today announced the successful mass production of its second-generation 90-nm G2 eFlash process platform with enhanced technical strength and competitiveness.

NXP Semiconductors N.V., the world's largest supplier of automotive semiconductor solutions, today announced a new generation of RoadLINK solutions that extend its leadership in the field of vehicle-to-everything communications. The new NXP SAF5400 is the world's first high-performance single-chip DSRC modem with automotive standards. With a unique scalable architecture, industry-leading new security features, and advanced RF complementary metal oxide semiconductor components (RFCMOS) and Software Defined Radio (SDR) technology, OEM manufacturers offer flexible options to District deployment of security V2X and on-site upgrades.

("Hua Hong Semiconductor" or "Company", together with its subsidiaries, collectively the "Group", stock code: 1347.HK) announced today that the Company's announcement of the Company's Microcontroller Unit (MCU) market, the latest launch of 95 nm single insulated gate non-volatile embedded memory (95 nm 5V SG eNVM) process platform. In ensuring the stability of the product at the same time, 95 nm 5V SG eVM process platform for its low power consumption, low cost advantage, widely favored by customers. The platform has been successfully mass production, product performance.

NXP Semiconductors today announced that it has jointly developed a new generation of automotive gateway platform based on Ethernet and security to promote the development of Ethernet gateway projects developed by China's first vehicle manufacturing enterprises. NXP will provide reference design and complete gateway solutions for the development of the platform, covering semiconductor devices such as microcontrollers and network interfaces. The two sides will be through the semiconductor enterprises and vehicle manufacturers to carry out direct technical cooperation in the form of China's auto industry to achieve ecological cooperation model breakthrough and innovation.

Raisar Electronics, Inc., the world's leading provider of semiconductor solutions, today announced that it has begun massaging its first R-Car system-on-chip (SoC) system using automotive-grade Linux (AGL) software.

GLOBALFOUNDRIES announces the introduction of its FX-7 ™ ASIC (Application Specific Integrated Circuits) using a 7nm FinFET process. The FX-7 is an integrated design platform that combines state-of-the-art process technology with differentiated intellectual property rights and 2.5D / 3D packaging technology to deliver the industry's most complete portfolio of data centers, machine learning, automotive, wireline communications and 5G wireless applications s solution.