From the second half of last year to this year, AI chips blossomed everywhere. Many AI start-ups in China have introduced their own AI chips, but Victor Peng, president and CEO of Cellings, the world's largest FPGA manufacturer, poured cold water on them, saying that start-ups should not start making AI chips from scratch.

On October 12, Beijing time, people familiar with the matter said that the U.S. authorities have begun to investigate whether the shares of Broadcom and CA Technologies have become targets of market manipulation plans.

As supply of 12 inch silicon wafers continues to be tight, major wafer manufacturers around the world, including Japan's Shenggao, Germany's Silitronic and Universal Wafers, have begun to expand production plans. In contrast, the mainland is also accelerating the development of 12 inch large silicon wafers. According to the current planning of domestic enterprises, it is estimated that the domestic 12-inch silicon wafer production capacity will reach 1.45 million wafers per month by 2020, covering domestic demand.

Bloomberg recently reported that China's electronics giant TCL is weighing its remaining stake in Dutch semiconductor equipment manufacturer ASM International NV (ASMI) in its listed Asian subsidiary, which is facing pressure from radical investors.

Leti, A Research Institute of ST and CEA Tech, announced a collaborative effort to develop silicon-based GaN power switching module manufacturing technology. The silicon-based GaN power technology will enable Italian Semiconductors to meet high-performance, high-power applications, including hybrid and electric vehicle chargers, wireless charging and servers.

Chip giant Intel CFO and interim CEO Bob Swan released an open letter Friday on the company's official website "Supply Update" in response to recent capital market queries about Intel's chip supply capacity and 10 nm chip manufacturing process. The letter first reviewed the significant growth of the industry in the first half of this year. The explosive growth of data and the need to process, store, analyze, and share data have spurred industry innovation and an astonishing demand for cloud, network, and enterprise computing performance.

In a report at the end of August, Mosesmann, an analyst at Rosenblatt Securities Securities, said that the bottleneck for Intel's semiconductor manufacturing was not just a 10-nanonode delay, but a lot of time to solve the problem, because it would create a five-year, six-year, and six-year process disadvantage for Intel. Even seven years.

The upstream of the semiconductor industry in the fourth quarter of 2018 seems to be beginning to show off-season pressures ahead of schedule. In line with the potential further weakening of GDP growth around the world in 2019, Taiwan IC designers have recently concentrated their R&D resources in emerging automotive electronics and the Internet of Things to avoid a stall in corporate revenue and profit growth. After all, these innovative products are emerging from scratch. As long as they can grab new orders, the company's performance in the coming year is bound to increase. Taiwan IC Design Co. has begun to keep pace with the international chip factories, expanding its AI, Internet of Things and automotive power. Sub chip solutions, hoping to compete for future huge business opportunities.

In the second half of 2018, the utilization rate of the wafer plant capacity is still high-end, coupled with the client still concerned about delivery and capacity, and did not deliberately lower prices, with many new pr...

NEC Corporation announced an investment in Tascent, Inc., a U.S. -based biometric systems company, to accelerate the global expansion of its security business. The demand for further security enhancement through multimod...