TSMC is currently holding the twenty-fourth Annual Technical Symposium in Santa Clara, which has just released a technology Wafer-on-Wafer (WoW, stacked wafer) that can bring revolutionary changes to the graphics card. As the name suggests, WoW works in a vertical stack, rather than placing them on a circuit board, just as the 3D NAND flash is stacked in a modern solid-state drive. This means that Nvidia and AMD GPU can improve their performance without increasing their physical size or reducing the manufacturing process.

April 2, 2018, China - STMicroelectronics X-Cube-AVS software package enables Amazons Alexa Voice Service (AVS) to run on STM32* microcontrollers, enabling cloud intelligence (automatic speech recognition and Advanced co...

Set micro-network news, Quan Zhi Technology (300458) on March 20 in the investor interaction platform, Xiaomi use the companys chips, mainly used in millet cleaning robot and drone series products.In 2017, Quanzhi Techno...

Recently, the National Bureau of Statistics released the Statistical Communique on the 2017 National Economic and Social Development of the Peoples Republic of China. The communiqué shows that the added value of industri...

Quantum technology opens up new avenues for the miniaturization of electronic components. Recently, the Fraunhofer Institute for Solid State Physics (IAF) and the Maple Institute for Solid State Research published inform...

Set micro-grid news, according to Taiwans supply chain shows that the semiconductor industry in the second quarter season is about to start, optimistic about the operating outlook, of which the automotive electronics and...

According to Taiwan media reports, should WiFi signal through the wall capabilities, the global router manufacturers have attacked the field of high-power dual-band 802.11ac wave2.0 field, the number of routers equipped...

The era of "all things connected" is gradually approaching. Since 2017 NB-IoT (Narrowband Internet of Things) ushered in large-scale commercial applications in China. All major telecom operators and network equipment providers have accelerated the pace of industrial distribution in order to boost the development of the domestic Internet of Things industry. Experts said that the Internet of Things is coming. However, the development of the Internet of Things often faces the phenomenon of fragmentation of technologies and applications. To overcome this difficulty, it is necessary to unite the efforts of all sectors in the industry to increase openness and cooperation and build an ecological environment where Dalian can connect and cooperate with each other.

Attacking DRAM market opportunities, Samsung Electronics announced the mass production of its second generation of 10 nanometer level (1y-nm) 8Gb DDR4 DRAM. The unit uses a high-sensitivity Cell Data Sensing System and an Air Spacer solution for higher performance, lower power consumption, and smaller footprint.

Hua Hong Semiconductor Co., Ltd. today announced the successful mass production of its second-generation 90-nm G2 eFlash process platform with enhanced technical strength and competitiveness.