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Nvidia Introduces The Latest Version Of The Compiler For Heterogeneous SupercomputingSource:NVIDIA Release Date:2017/9/22 Click On:6126
NVIDIA today announced the release of the 17.7 Edition PGI 2017 Compiler and Tools to help high-performance computing systems developers develop higher-performing software for systems equipped with multi-core CPUs and heterogeneous GPU accelerators, while dramatically simplifying program design Process.
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U-blox Synchronous Gnss / Lte Cat1 Module Accelerates Self-drivingSource:u-blox Release Date:2017/9/6 Click On:3849
The rise of networked car applications has subverted the traditional imagination of the car - through the combination of sensors, positioning, cellular and short-range communications technology, exciting new V2X architecture, opened an unprecedented new generation of automotive awareness.
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Ni Introduces New Pxi Remote Control And Bus Expansion Modules For High Throughput ApplicationsSource:National Instruments Release Date:2017/9/6 Click On:3633
NI (National Instruments, National Instruments, Inc.) as a commitment to engineers and scientists to provide solutions to meet the world's most serious engineering challenges of the supplier, today announced the launch of a series of PCI Express Gen 3 connected high-performance PXI Remote control and bus expansion module. PCI Express Gen 3 technology provides higher bandwidth, which brings the gospel to applications such as 5G mobile research, RF recording and playback, and high-channel data acquisition, which require significant amounts of data.
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Hua Hong Semiconductor Pushing 95 Nm Envm Process Platform To Win The 8-bit Mcu MarketSource:Hua Hong Semiconductor Release Date:2017/9/4 Click On:4442
("Hua Hong Semiconductor" or "Company", together with its subsidiaries, collectively the "Group", stock code: 1347.HK) announced today that the Company's announcement of the Company's Microcontroller Unit (MCU) market, the latest launch of 95 nm single insulated gate non-volatile embedded memory (95 nm 5V SG eNVM) process platform. In ensuring the stability of the product at the same time, 95 nm 5V SG eVM process platform for its low power consumption, low cost advantage, widely favored by customers. The platform has been successfully mass production, product performance.
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Allegro Microsystems Introduces A User-configurable Dual Fault FeatureSource:Allegro Release Date:2017/8/18 Click On:3630
Allegro MicroSystems, LLC announced a new high-precision Hall effect current sensor IC ACS720 with a variety of programmable fault levels for industrial and consumer applications, especially for motor control and power inverter applications.
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Iphone 8 Pull Goods To Start Nor Flash Exclusive Supplier Winbond Power To Next YearSource:Chinatimes Release Date:2017/8/17 Click On:3674
Memory plant Winbond successfully into the Apple iPhone 8 supply chain. According to Apple supply chain industry, said Winbond exclusive supply of NOR Flash products, and Samsung AMOLED panel together into a mobile phone panel module, in August began heavy volume shipments, and applied in the Apple iPhone 8 products, on behalf of China Bang electric operation will be expected to flourish to the first half of next year.
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The Silicon Labs Radio Product Family Addresses The Growing Cost-effectiveness Challenge In The Automotive IndustrySource:Silicon Labs Release Date:2017/8/10 Click On:4532
Silicon Labs (also known as "Core Technology") has launched the industry's most scalable, flexible and cost-effective car radio solution for the global automotive infotainment market.
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Marvell Introduces Industry's First Gb-class Ethernet Switch With Secure FunctionalitySource:Marvell Release Date:2017/8/9 Click On:3671
Marvell Mavell (NASDAQ: MRVL), the world's leading provider of storage, cloud and networking, today announced the industry's first Gigabit Ethernet switch to provide higher connectivity for next-generation interconnects Level of secure data transmission
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Us-based Release Of The New Switchtec Pax Pcie Switching Chip That Supports Network InterconnectionSource:Microsemi Corporation Release Date:2017/8/9 Click On:3781
Microsemi Corporation, a leading provider of differentiated semiconductor technology solutions for power, security, reliability and performance, today announced that its Switchtec PAX network interconnects Gen3 PCIe switching chips to provide high-performance network connectivity , For scalable multi-host systems and Just a bunch of flash (JBOF), and supports single input / output (I / O) virtualization (SR-IOV), NVMe, and multifunction endpoints.
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Vishay Introduced The Industry's First Mlcc For High Frequency Rf And Microwave ApplicationsSource:Vishay Release Date:2017/8/8 Click On:4599
Vishay Intertechnology, Inc. today announced the industry's first surface-mount multilayer ceramic chip capacitors (MLCC) for high frequency RF and microwave applications - the VitramonVJ HIFREQ HT series with operating temperature range of +200 ° C
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