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The Research Institutes Released The Ai Chip Company's Ranking: The Largest Group In The World, Ranked Twelfth.Source:laoyaoba.com Release Date:2018/5/8 Click On:6143
According to foreign media reports, artificial intelligence (AI) is one of the most popular areas today. Over the past three years, the global investment in artificial intelligence has exceeded $60 billion, and artificial intelligence start-ups more than 1700.
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Ai Chip Innovation Enterprise List Released Nxp Ranked The World's Top ThreeSource:laoyaoba.com Release Date:2018/4/27 Click On:4379
Compass Intelligence (CompassIntel.com), a leading market research and consulting company in the field of information technology and communications, has been selected as one of the world's top three AI (AI) chip enterprises, according to the results of the recent research and research of the leading market research and consulting company in the field of information technology and communications. The selection list covers the world's leading enterprises in mobile devices, IoT and emerging technologies. NXP and NVIDIA and Intel are among the top three leading AI companies in AI innovation.
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Warning: Semiconductor Industry Chain Adjustment Release Signal Gpa Asic Mining Start To Cool DownSource:laoyaoba.com Release Date:2018/3/14 Click On:5373
Virtual currency prices have soared over the past year, driving sharp increase in mining demand, and the performance of the semiconductor supply chain is booming. However, graphics card makers recently pointed out that,...
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Huawei's First 5g Commercial Chip Released 5g "leadership Circle" Competition UpgradeSource: Release Date:2018/3/5 Click On:12810
On the MWC2018, Huawei released the first 3GPP 5G01 commercial standard chip 5G01 (Balong 5G01) and Huawei 5G CPE (Consumer Premise Equipment) to support the worlds mainstream 5G band and theoretically achieve data downl...
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Altek, Huajing Branch Will Release The Latest 3d Sensing Depth Chip At CesSource:Altek Release Date:2018/1/8 Click On:3838
International Consumer Electronics Show CES exhibition on January 9 will be launched in Las Vegas, Taiwan digital imaging program expert Hua Jingke will be released at the CES show the latest 3D sensing depth chip AL6100, hoping to borrow by The world's largest science and technology exhibition so that the world see Huajing Branch of the technical strength and products.
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Nxp Released The World's First Single-chip, Scalable Security V2x PlatformSource:NXP Semiconductors Release Date:2017/9/19 Click On:5732
NXP Semiconductors N.V., the world's largest supplier of automotive semiconductor solutions, today announced a new generation of RoadLINK solutions that extend its leadership in the field of vehicle-to-everything communications. The new NXP SAF5400 is the world's first high-performance single-chip DSRC modem with automotive standards. With a unique scalable architecture, industry-leading new security features, and advanced RF complementary metal oxide semiconductor components (RFCMOS) and Software Defined Radio (SDR) technology, OEM manufacturers offer flexible options to District deployment of security V2X and on-site upgrades.
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Innodisk Released Ddr4 2666 Memory Module SolutionSource:Innodisk Release Date:2017/8/29 Click On:3756
Innodisk (Innodisk) recently released a full range of DDR4 2666 embedded memory module solutions. Including a variety of specifications and sizes, can support a new generation of Intel Core X extreme performance desktop platform, and Intel Xeon Purley server platform (Xeon Scalable series processors) and other computer systems.
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Accelstor Released The Latest High Availability And Can Be Vertically Extended Full Flash Memory Storage ArraySource:AccelStor Release Date:2017/8/24 Click On:3711
AccelStor Announces New High Availability and Expandable Full Flash Memory Storage Array The NeoSapphire H710 provides flexible, flexible storage configurations for mission critical applications for enterprise users Capacity can be expanded from 27TB to 221TB.
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Us-based Release Of The New Switchtec Pax Pcie Switching Chip That Supports Network InterconnectionSource:Microsemi Corporation Release Date:2017/8/9 Click On:3780
Microsemi Corporation, a leading provider of differentiated semiconductor technology solutions for power, security, reliability and performance, today announced that its Switchtec PAX network interconnects Gen3 PCIe switching chips to provide high-performance network connectivity , For scalable multi-host systems and Just a bunch of flash (JBOF), and supports single input / output (I / O) virtualization (SR-IOV), NVMe, and multifunction endpoints.
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Linghua Technology Released The New Embedded Fanless Computer Mvp-5000Source:ADLINK TECHNOLOGY Release Date:2017/6/13 Click On:3737
Linghua Technology, the world's leading provider of edge computing platform, announced the launch of the new embedded fanless computer MVP-5000, which carries the sixth generation Intel Core processor, computing performance beyond the previous generation processor 30%
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