Toshiba launched a 30V N channel co -drain MOSFET, which is suitable for equipment with USB and battery pack protectionToshiba Electronic Component and Storage Device Co., Ltd. (Toshiba) announced today that the launch o...

Superlight Photonics promotes innovation through the worlds portable broadband laserSuper continuous spectrumLaserThe pioneer of technology, SUPERLIGHT Photonics, launched the first revolutionary portable broadband laser...

AI visual chip research and development and basic computing power platform company Aixin Yuanzhi announced that it has released the new generation of IPC SoC chip products AX630C and AX620Q, which has attracted attention...

Peoples Daily: U.S. chip companies cannot tolerate more restrictions on Chinese salesAlthough American politicians seem to be determined to continue to seek a strategy of decoupling with China in the high -tech field, th...

The two departments joined forces to start the work of the Smart Manufacturing System Solution in 2023The Ministry of Industry and Information Technology and the State Administration of Market Supervision recently issued...

On October 1st, Shenzhen Jiangbo Long Electronics Co., Ltd. (hereinafter referred to as Jiang Bolong) acquired 70%equity transaction of Licheng Technology (Suzhou) Co., Ltd., and has officially completed the delivery, an...

Microchip launched the industrys first low -footed MCU series products that support i3C As the data collected and transmitted from the cloud connection edge node gradually increases, the improved integrated circuit (i3C...

What kind of memory does AI chip need? last week, I (referred to the author of this article) was fortunate to host a group discussion at the artificial intelligence hardware and marginal artificial intelligence summit,...

The four departments issued an announcement: Increase the proportion of R D expenses of integrated circuits and industrial parent machine enterprises The Ministry of Finance, the Ministry of Industry and Information Te...

SEMI: By 2026, the capacity of 200mm wafer fab in the world will reach a record high Global semiconductor manufacturers are expected to increase the production capacity of 200 mm wafers by 14%from 2023 to 2026, adding 1...