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Cambium Networks Has Introduced A New Wireless Broadband Point-to-point BridgeSource:Cambium Networks Release Date:2017/8/7 Click On:3812
Wiium Networks, the world's leading provider of wireless networking solutions, today announced the launch of the ePMP Bridge-in-a-Box wireless Ethernet bridge. The solution includes two ePMP Force 180 user modules (preconfigured and co-packaged) that support plug-and-play operations in almost all applications.
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Linear Technology 4 Output Monolithic Synchronous Step-down Converter Lt8602Source:Linear Technology Release Date:2017/8/7 Click On:3643
Advanced Driver Assistance Systems (ADAS) helps to drive safely and alerts the driver when the system detects a risk from the surrounding object, no matter what the risk is. Increasing the ADAS system is one of the major trends in the car from 2016 to 2020.
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Bourns Multifuse Product Line New ForceSource:Bourns Release Date:2017/8/7 Click On:3614
Bourns, a leading global supplier of electronic components, announced the addition of a new force to its award-winning Multifuse products - AEC-Q200 certified high temperature polymer polymer positive temperature coefficient (PPTC) self-healing fuse.
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Gloriafeld Launches 7-nanometer Special Application Integrated Circuit Platform For Data Center, Machine Learning And 5g NetworkSource:GLOBALFOUNDRIES Release Date:2017/6/19 Click On:5310
GLOBALFOUNDRIES announces the introduction of its FX-7 ™ ASIC (Application Specific Integrated Circuits) using a 7nm FinFET process. The FX-7 is an integrated design platform that combines state-of-the-art process technology with differentiated intellectual property rights and 2.5D / 3D packaging technology to deliver the industry's most complete portfolio of data centers, machine learning, automotive, wireline communications and 5G wireless applications s solution.
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Maxim Introduces Automotive Led Control For External Lighting And Improved Safety Applications With Fast Response Time And Low EmiSource:Maxim Release Date:2017/6/19 Click On:4988
Maxim announced the MAX20078 Synchronous Buck, High Brightness LED Controller, the industry's only component that provides both fast response time and low EMI (EMI) for external LED lighting and improved safety applications. The LED controller can be used for matrix lighting design, providing designers with high-performance, simple design, and can quickly market solutions.
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The Wireless Gecko Soc Product Family Supports Comprehensive Bluetooth 5 Connectivity And Extended Memory OptionsSource: Wireless Gecko Release Date:2017/6/19 Click On:4135
Silicon Labs (also known as "Core Technology") has introduced a new multi-band SoC that supports full Bluetooth 5 connectivity and more storage capacity options to further expand its Wireless Gecko system single-chip (SoC) product line.
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Qorvo Introduces The Industry's First High-power Baw Filter For 5g MigrationSource:Qorvo Release Date:2017/6/16 Click On:5220
Qorvo, Inc., a provider of innovative RF solutions for the interconnected world, today announced the industry's smallest sound wave (BAW) filter, the QPQ1300, which handles an average 5W RF input power with a peak power of 40W.
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On Semiconductor Improves Imaging Performance For High-resolution Industrial ApplicationsSource:ON Semiconductor Release Date:2017/6/15 Click On:4734
ON Semiconductor's KAI-29052 is available in a CPGA-72 package that conforms to the Restriction of Hazardous Substances Directive (RoHS), with black and white, Bayer and Sparse Color configurations, and with the existing KAI-29050 image sensor and a full range of 5.5 Micron and 7.4 micron CCD image sensor are fully pin compatible, enabling camera manufacturers to quickly adopt new components.
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Toshiba Introduces Low Current Consumption For Low Current Consumption And Enhanced Safety CommunicationsSource:Toshiba Release Date:2017/6/15 Click On:4941
Toshiba Semiconductor and Storage Products announced two new "TC3567CFSG" and "TC3567DFSG" leading industry [1] to achieve lower current consumption than the plateau [2] and enhance the safety communication function. These two ICs are Toshiba's latest members of Bluetooth-enabled low power (LE) [3] ver.4.2 communication chips. The sample is available.
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Intel Invested $ 178 Million To Set Up A R & D Center In IndiaSource:Tencent Technology Release Date:2017/6/15 Click On:5513
According to foreign media reports, today, Intel announced that it will invest $ 178 million in Bangalore, India, the new one of the most advanced design and research and development center. The center will be located in Intel's 44-acre headquarters, covering an area of about 620,000 square feet, responsible for the design and verification of the chip.
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