NVIDIA announces today that it will work with IBM to develop a new integrated infrastructure to assist enterprises in rapid deployment and easy management of AI infrastructure through IBM SpectrumAI and NVIDIA DGX.NVIDIA...

The International Semiconductor Industry Association (ISIA) issued a year-end overall equipment forecasting report, which pointed out that global sales of new semiconductor manufacturing equipment in 2018 amounted to $62...

The bail hearing of Meng Wanzhou, a Chinese citizen detained in Canada, failed to reach a conclusion on the 10th, and the judge said it would continue on the 11th. At 10 a.m. local time, the bail hearing for Ms. Meng Wan...

Duntai Electronics announced a combined revenue of NT$696 million in November 2018, which was affected by the traditional off-season, combined with the impact of the Sino-US trade war on customers'willingness to pull goo...

South Korea's "Asian Economy" reported on December 3 that the brain drain in the semiconductor industry in South Korea has been a red light, and the main reason for this situation is that Korean media blame Chinese offic...

To mitigate the impact of the trade war between the United States and China, it is reported that the major iPhone assembly plants and Heshuo have selected Indonesia as the first step in their plans to divert production l...

Jiwei News, recently, foreign media pointed out that Hon Hai U.S. subsidiary will be restructured. Hon Hai Science and Technology Group issued a statement today (28) confirming this, but also stressed that restructuring...

At the end of Taiwan's nine-in-one election, it was reported that newly elected quasi-mayor Koreayo and Foxconn Chairman Guo Taiming had telephoned to invite investment in Kaohsiung, making Foxconn's research and develop...

Huang Renxun said that AI, as one of the most powerful technologies ever, enables machines to learn from large amounts of data and write software. With AI, industries can learn from massive data to build prediction model...

According to a survey conducted by Taiwan research institutes, 5G high frequency communication chip packaging is expected to develop towards AiP technology and fan-out packaging technology in the future. It is expected t...