According to the latest report of Counterpoint's third quarter 2017 market monitoring project, the strong performance of Korean brands Samsung and Chinese brands in the third quarter of 2017 drove up 13% of the global mobile phone overall profit. The cumulative profits of domestic brands for the first time in just over a quarter of more than 1.5 billion US dollars.

International Consumer Electronics Show CES exhibition on January 9 will be launched in Las Vegas, Taiwan digital imaging program expert Hua Jingke will be released at the CES show the latest 3D sensing depth chip AL6100, hoping to borrow by The world's largest science and technology exhibition so that the world see Huajing Branch of the technical strength and products.

The era of "all things connected" is gradually approaching. Since 2017 NB-IoT (Narrowband Internet of Things) ushered in large-scale commercial applications in China. All major telecom operators and network equipment providers have accelerated the pace of industrial distribution in order to boost the development of the domestic Internet of Things industry. Experts said that the Internet of Things is coming. However, the development of the Internet of Things often faces the phenomenon of fragmentation of technologies and applications. To overcome this difficulty, it is necessary to unite the efforts of all sectors in the industry to increase openness and cooperation and build an ecological environment where Dalian can connect and cooperate with each other.

Yesterday, Baoneng New Energy Vehicle Co., Ltd., Guangdong Cores Chip Project and IC Industrial Innovation Park of Guangzhou Development Zone and the Southern Hospital of Knowledge City started construction in Zhongxin Knowledge City. Guangzhou Municipal Committee Ren Xuefeng, deputy secretary of municipal Party committee, mayor Wen Guohui, municipal CPPCC Chairman Liu Yuelun respectively with the Group Chairman Yao Zhenhua, Guangzhou Jin Yu Industrial Investment Group Chairman Li Yongxi, Guangzhou Yuecun Semiconductor Technology Co., Chip and the first batch of contracted 15 project leaders (including 9 chip design projects, 1 design and test service platform, 3 package test items, 1 material project, 1 industrial fund) who settled in IC Development Park of Guangzhou Development Zone Project), Southern Medical University Party Secretary Chen Minsheng, Nanfang Hospital Dean Li Wenyuan, Southern Hospital Party Secretary Zhu Hong discussion. City leaders Chen Zhiying, Zhou Yawei, Pan Jianguo, dawn to participate.

DRAM market conditions will be different next year, DRAM market will continue to be tight, NAND Flash market will be in the first half of next year into oversupply.

NVIDIA today announced the release of the 17.7 Edition PGI 2017 Compiler and Tools to help high-performance computing systems developers develop higher-performing software for systems equipped with multi-core CPUs and heterogeneous GPU accelerators, while dramatically simplifying program design Process.

Tektronix, the world's leading supplier of measurement solutions, today introduced the new DPO7OE1, a calibrated optical probe and analysis software for use with real-time oscilloscopes, and is an optical reference for compatibility with 28-GBaud PAM4 applications Receiver (ORR), and can support IEEE / OIF-CEI standard specific measurement. The new solution complements Tektronix's sampling oscilloscope optical PAM4 analysis tool, providing the design team with an effective test solution for all stages of the optical transmitter workflow.

NXP Semiconductors N.V., the world's largest supplier of automotive semiconductor solutions, today announced a new generation of RoadLINK solutions that extend its leadership in the field of vehicle-to-everything communications. The new NXP SAF5400 is the world's first high-performance single-chip DSRC modem with automotive standards. With a unique scalable architecture, industry-leading new security features, and advanced RF complementary metal oxide semiconductor components (RFCMOS) and Software Defined Radio (SDR) technology, OEM manufacturers offer flexible options to District deployment of security V2X and on-site upgrades.

SAN FRANCISCO (MarketWatch) - Western Digital Inc. (NYSE: TXN) today announced the launch of the 400GB Flash Digital High-Speed Mobile MicroSDXC UHS-I card, a microSD card for high-capacity mobile devices. After two years ago, after launching the 200GB Red Dodge high-speed mobile microSDXC card, Western Digital Inc. doubled storage capacity to double the same volume of SD card to 400GB.

KLA-Tencor today introduced five development control systems for logic and cutting-edge memory design nodes below 7 nm to help wafer manufacturers achieve the rigorous process tolerances required for multiple exposure techniques and EUV lithography. At the IC manufacturing facility, the ATL stacking measurement system and the SpectraFilmF1 thin film measurement system provide process characterization analysis and offset monitoring for the fabrication of finFET, DRAM, 3D NAND and other complex component structures.