Marvell Mavell (NASDAQ: MRVL), the world's leading provider of storage, cloud and networking, today announced the industry's first Gigabit Ethernet switch to provide higher connectivity for next-generation interconnects Level of secure data transmission

Vishay Intertechnology, Inc. today announced the industry's first surface-mount multilayer ceramic chip capacitors (MLCC) for high frequency RF and microwave applications - the VitramonVJ HIFREQ HT series with operating temperature range of +200 ° C

Littelfuse, Inc., a global leader in circuit protection, today introduced a compact surface mount polymer automotive-grade electrostatic discharge suppressor that protects sensitive equipment from hazards of up to 30kV of contact discharge / air discharge.

Advanced Driver Assistance Systems (ADAS) helps to drive safely and alerts the driver when the system detects a risk from the surrounding object, no matter what the risk is. Increasing the ADAS system is one of the major trends in the car from 2016 to 2020.

Maxim announced the MAX20078 Synchronous Buck, High Brightness LED Controller, the industry's only component that provides both fast response time and low EMI (EMI) for external LED lighting and improved safety applications. The LED controller can be used for matrix lighting design, providing designers with high-performance, simple design, and can quickly market solutions.

Qorvo, Inc., a provider of innovative RF solutions for the interconnected world, today announced the industry's smallest sound wave (BAW) filter, the QPQ1300, which handles an average 5W RF input power with a peak power of 40W.

ON Semiconductor's KAI-29052 is available in a CPGA-72 package that conforms to the Restriction of Hazardous Substances Directive (RoHS), with black and white, Bayer and Sparse Color configurations, and with the existing KAI-29050 image sensor and a full range of 5.5 Micron and 7.4 micron CCD image sensor are fully pin compatible, enabling camera manufacturers to quickly adopt new components.

​According to foreign media reports, today, Intel announced that it will invest $ 178 million in Bangalore, India, the new one of the most advanced design and research and development center. The center will be located in Intel's 44-acre headquarters, covering an area of about 620,000 square feet, responsible for the design and verification of the chip.

On the morning of June 13, the total investment of 35 billion yuan Wuhan Huaxing photoelectric 6th generation flexible LTPS-AMOLED production line (Huaxing photoelectric t4 project), in the optical Valley intelligent manufacturing industry park started.

Today announced the availability of its 7nm lead performance (7LP) FinFET semiconductor technology, with 40% of the leapfrog performance boost to meet the needs of applications such as high-end mobile processors, cloud servers and network infrastructures. Design Suite is now ready, based on 7LP technology, the first batch of customer products is expected to launch in the first half of 2018, and will be the second half of 2018 to achieve mass production.